P-metal gate first gate replacement process for multigate devices

ABSTRACT

Multi-gate devices and methods for fabricating such are disclosed herein. An exemplary method includes forming a gate dielectric layer around first channel layers in a p-type gate region and around second channel layers in an n-type gate region. Sacrificial features are formed between the second channel layers in the n-type gate region. A p-type work function layer is formed over the gate dielectric layer in the p-type gate region and the n-type gate region. After removing the p-type work function layer from the n-type gate region, the sacrificial features are removed from between the second channel layers in the n-type gate region. An n-type work function layer is formed over the gate dielectric layer in the n-type gate region. A metal fill layer is formed over the p-type work function layer in the p-type gate region and the n-type work function layer in the n-type gate region.

BACKGROUND

The electronics industry has experienced an ever-increasing demand forsmaller and faster electronic devices that are simultaneously able tosupport a greater number of increasingly complex and sophisticatedfunctions. To meet these demands, there is a continuing trend in theintegrated circuit (IC) industry to manufacture low-cost,high-performance, and low-power ICs. Thus far, these goals have beenachieved in large part by reducing IC dimensions (for example, minimumIC feature size), thereby improving production efficiency and loweringassociated costs. However, such scaling has also increased complexity ofthe IC manufacturing processes. Thus, realizing continued advances in ICdevices and their performance requires similar advances in ICmanufacturing processes and technology.

Recently, multigate devices have been introduced to improve gatecontrol. Multigate devices have been observed to increase gate-channelcoupling, reduce OFF-state current, and/or reduce short-channel effects(SCEs). One such multigate device is the gate-all around (GAA) device,which includes a gate structure that can extend, partially or fully,around a channel region to provide access to the channel region on atleast two sides. GAA devices enable aggressive scaling down of ICtechnologies, maintaining gate control and mitigating SCEs, whileseamlessly integrating with conventional IC manufacturing processes. AsGAA devices continue to scale, challenges have arisen when fabricating agate structure for a GAA device that includes an n-metal gate thatshares a boundary with a p-metal gate, which challenges have beenobserved to degrade GAA device performance and increase GAA processingcomplexity. Accordingly, although existing GAA devices and methods forfabricating such have been generally adequate for their intendedpurposes, they have not been entirely satisfactory in all respects.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposesonly. In fact, the dimensions of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1A and FIG. 1B are a flow chart of a method for fabricating amultigate device according to various aspects of the present disclosure.

FIGS. 2A-23A, FIGS. 2B-23B, FIGS. 2C-23C, and FIGS. 2D-23D arefragmentary diagrammatic views of a multigate device, in portion orentirety, at various fabrication stages (such as those associated withthe method in FIG. 1A and FIG. 1B) according to various aspects of thepresent disclosure.

DETAILED DESCRIPTION

The present disclosure relates generally to integrated circuit devices,and more particularly, to multigate devices, such as gate-all-around(GAA) devices.

The following disclosure provides many different embodiments, orexamples, for implementing different features. Reference numerals and/orletters may be repeated in the various examples described herein. Thisrepetition is for the purpose of simplicity and clarity and does not initself dictate a relationship between the various disclosed embodimentsand/or configurations. Further, specific examples of components andarrangements are described below to simplify the present disclosure.These are, of course, merely examples and are not intended to belimiting. For example, the formation of a first feature over or on asecond feature in the description that follows may include embodimentsin which the first and second features are formed in direct contact, andmay also include embodiments in which additional features may be formedbetween the first and second features, such that the first and secondfeatures may not be in direct contact. Moreover, the formation of afeature on, connected to, and/or coupled to another feature in thepresent disclosure may include embodiments in which the features areformed in direct contact, and may also include embodiments in whichadditional features may be formed interposing the features, such thatthe features may not be in direct contact.

Further, spatially relative terms, for example, “lower,” “upper,”“horizontal,” “vertical,” “above,” “over,” “below,” “beneath,” “up,”“down,” “top,” “bottom,” etc. as well as derivatives thereof (e.g.,“horizontally,” “downwardly,” “upwardly,” etc.) are used herein for easeof description to describe one element or feature's relationship toanother element(s) or feature(s). The spatially relative terms areintended to encompass different orientations than as depicted of adevice (or system or apparatus) including the element(s) or feature(s),including orientations associated with the device's use or operation.The apparatus may be otherwise oriented (rotated 90 degrees or at otherorientations) and the spatially relative descriptors used herein maylikewise be interpreted accordingly.

FIG. 1A and FIG. 1B are a flow chart of a method 100 for fabricating amultigate device according to various aspects of the present disclosure.In some embodiments, method 100 fabricates a multi-gate device thatincludes p-type GAA transistors and n-type GAA transistors. At block102, a first semiconductor layer stack and a second semiconductor layerstack are formed over a substrate. The first semiconductor layer stackand the second semiconductor layer stack include first semiconductorlayers and second semiconductor layers stacked vertically in analternating configuration. At block 104, a gate structure is formed overa first region of the first semiconductor layer stack and a first regionof the second semiconductor layer stack. The gate structure includes adummy gate stack and gate spacers. At block 106, portions of the firstsemiconductor layer stack in second regions and portions of the secondsemiconductor layer stack in second regions are removed to formsource/drain recesses. At block 108, inner spacers are formed alongsidewalls of the first semiconductor layers in the first semiconductorlayer stack and the second semiconductor layer stack. At block 110,epitaxial source/drain features are formed in the source/drain recesses.At block 112, an interlayer dielectric (ILD) layer is formed over theepitaxial source/drain features. At block 114, the dummy gate stack isremoved, thereby forming a gate trench that exposes the firstsemiconductor layer stack in a p-type gate region and the secondsemiconductor layer stack in n-type gate region. At block 116, the firstsemiconductor layers are removed from the first semiconductor layerstack and the second semiconductor layer stack exposed by the gatetrench, thereby forming gaps between the second semiconductor layers. Atblock 118, a gate dielectric layer is formed in the gate trench aroundthe second semiconductor layers in the p-type gate region and the n-typegate region. The gate dielectric layer partially fills the gaps betweenthe second semiconductor layers.

At block 120, a sacrificial layer is formed over the gate dielectriclayer in the gate trench in the p-type gate region and the n-type gateregion. The sacrificial layer fills any remaining portion of the gapsbetween the second semiconductor layers. At block 122, the sacrificiallayer is patterned to form sacrificial features between the secondsemiconductor layers in the p-type gate region and the n-type gateregion. At block 124, the sacrificial features from are removed frombetween the second semiconductor layers in the p-type gate region. Atblock 126, a p-type work function layer is formed in the gate trenchover the gate dielectric in the p-type gate region and the n-type gateregion. At block 128, the p-type work function layer is removed from thegate trench in the n-type gate region. At block 130, a determination ismade whether the gate dielectric layer and the p-type work functionlayer fill the gate trench in the p-type gate region along a gate lengthdirection. If no, block 128 and block 130 are repeated. If yes, method100 proceeds to block 132, where the sacrificial features are removedfrom between the second semiconductor layers in the n-type gate region.At block 134, an n-type work function layer is formed in the gate trenchover the gate dielectric layer in the n-type gate region and over thep-type work function layer in the p-type gate region. At block 136, then-type work function layer is removed from the gate trench in the p-typegate region. At block 138, a metal bulk layer is formed in the gatetrench over the n-type work function layer in the n-type gate region andover the p-type work function layer in the p-type gate region. At block140, a planarization process is performed on the metal bulk layer, then-type work function layer, the p-type work function layer, and the gatedielectric layer, thereby forming a p-metal gate in the p-type gateregion and an n-metal gate in the n-type gate region. Method 100 thenproceeds to block 142 where contacts are formed. Additional processingis contemplated by the present disclosure. Additional steps can beprovided before, during, and after method 100, and some of the stepsdescribed can be moved, replaced, or eliminated for additionalembodiments of method 100. The discussion that follows illustratesvarious embodiments of nanowire-based integrated circuit devices thatcan be fabricated according to method 100.

FIGS. 2A-23A, FIGS. 2B-23B, FIGS. 2C-23C, and FIGS. 2D-23D arefragmentary diagrammatic views of a multigate device 200, in portion orentirety, at various fabrication stages (such as those associated withmethod 100 in FIG. 1A and FIG. 1B) according to various aspects of thepresent disclosure. In particular, FIGS. 2A-23A are top views ofmultigate device 200 in an X-Y plane; FIGS. 2B-23B are diagrammaticcross-sectional views of multigate device 200 in an X-Z plane alonglines B-B′ respectively of FIGS. 2A-23A, FIGS. 2C-23C are diagrammaticcross-sectional views of multigate device 200 in a Y-Z plane along linesC-C′ respectively of FIGS. 2A-23A; and FIGS. 2D-23D are diagrammaticcross-sectional views of multigate device 200 in the Y-Z plane alonglines D-D′ respectively of FIGS. 2A-23A. Multigate device 200 may beincluded in a microprocessor, a memory, and/or other IC device. In someembodiments, multigate device 200 is a portion of an IC chip, a systemon chip (SoC), or portion thereof, that includes various passive andactive microelectronic devices such as resistors, capacitors, inductors,diodes, p-type field effect transistors (PFETs), n-type field effecttransistors (NFETs), metal-oxide semiconductor field effect transistors(MOSFETs), complementary metal-oxide semiconductor (CMOS) transistors,bipolar junction transistors (BJTs), laterally diffused MOS (LDMOS)transistors, high voltage transistors, high frequency transistors, othersuitable components, or combinations thereof. In some embodiments,multigate device 200 is included in a non-volatile memory, such as anon-volatile random access memory (NVRAM), a flash memory, anelectrically erasable programmable read only memory (EEPROM), anelectrically programmable read-only memory (EPROM), other suitablememory type, or combinations thereof. FIGS. 2A-23A, FIGS. 2B-23B, FIGS.2C-23C, and FIGS. 2D-23D have been simplified for the sake of clarity tobetter understand the inventive concepts of the present disclosure.Additional features can be added in multigate device 200, and some ofthe features described below can be replaced, modified, or eliminated inother embodiments of multigate device 200.

Turning to FIGS. 2A-2D, multigate device 200 includes a substrate(wafer) 202. In the depicted embodiment, substrate 202 includes silicon.Alternatively or additionally, substrate 202 includes another elementarysemiconductor, such as germanium; a compound semiconductor, such assilicon carbide, gallium arsenide, gallium phosphide, indium phosphide,indium arsenide, and/or indium antimonide; an alloy semiconductor, suchas silicon germanium (SiGe), GaAsP, AlInAs, AlGaAs, GaInAs, GaInP,and/or GaInAsP; or combinations thereof. Alternatively, substrate 202 isa semiconductor-on-insulator substrate, such as a silicon-on-insulator(SOI) substrate, a silicon germanium-on-insulator (SGOI) substrate, or agermanium-on-insulator (GOI) substrate. Semiconductor-on-insulatorsubstrates can be fabricated using separation by implantation of oxygen(SIMOX), wafer bonding, and/or other suitable methods. Substrate 202 caninclude various doped regions depending on design requirements ofmultigate device 200. In the depicted embodiment, substrate 202 includesa p-type doped region 204A (referred to hereinafter as a p-well), whichcan be configured for n-type GAA transistors, and an n-type doped region204B (referred to hereinafter as an n-well), which can be configured forp-type GAA transistors. N-type doped regions, such as n-well 204B, aredoped with n-type dopants, such as phosphorus, arsenic, other n-typedopant, or combinations thereof. P-type doped regions, such as p-well204A, are doped with p-type dopants, such as boron, indium, other p-typedopant, or combinations thereof. In some implementations, substrate 202includes doped regions formed with a combination of p-type dopants andn-type dopants. The various doped regions can be formed directly onand/or in substrate 202, for example, providing a p-well structure, ann-well structure, a dual-well structure, a raised structure, orcombinations thereof. An ion implantation process, a diffusion process,and/or other suitable doping process can be performed to form thevarious doped regions.

A semiconductor layer stack 205 is formed over substrate 202, wheresemiconductor layer stack 205 includes semiconductor layers 210 andsemiconductor layers 215 stacked vertically (e.g., along thez-direction) in an interleaving or alternating configuration from asurface of substrate 202. In some embodiments, semiconductor layers 210and semiconductor layers 215 are epitaxially grown in the depictedinterleaving and alternating configuration. For example, a first one ofsemiconductor layers 210 is epitaxially grown on substrate, a first oneof semiconductor layers 215 is epitaxially grown on the first one ofsemiconductor layers 210, a second one of semiconductor layers 210 isepitaxially grown on the first one of semiconductor layers 215, and soon until semiconductor layers stack 205 has a desired number ofsemiconductor layers 210 and semiconductor layers 215. In suchembodiments, semiconductor layers 210 and semiconductor layers 215 canbe referred to as epitaxial layers. In some embodiments, epitaxialgrowth of semiconductor layers 210 and semiconductor layers 215 isachieved by a molecular beam epitaxy (MBE) process, a chemical vapordeposition (CVD) process, a metalorganic chemical vapor deposition(MOCVD) process, other suitable epitaxial growth process, orcombinations thereof.

A composition of semiconductor layers 210 is different than acomposition of semiconductor layers 215 to achieve etching selectivityand/or different oxidation rates during subsequent processing. In someembodiments, semiconductor layers 210 have a first etch rate to anetchant and semiconductor layers 215 have a second etch rate to theetchant, where the second etch rate is less than the first etch rate. Insome embodiments, semiconductor layers 210 have a first oxidation rateand semiconductor layers 215 have a second oxidation rate, where thesecond oxidation rate is less than the first oxidation rate. In thedepicted embodiment, semiconductor layers 210 and semiconductor layers215 include different materials, constituent atomic percentages,constituent weight percentages, thicknesses, and/or characteristics toachieve desired etching selectivity during an etching process, such asan etching process implemented to form suspended channel layers inchannel regions of multigate device 200. For example, wheresemiconductor layers 210 include silicon germanium and semiconductorlayers 215 include silicon, a silicon etch rate of semiconductor layers215 is less than a silicon germanium etch rate of semiconductor layers210. In some embodiments, semiconductor layers 210 and semiconductorlayers 215 can include the same material but with different constituentatomic percentages to achieve the etching selectivity and/or differentoxidation rates. For example, semiconductor layers 210 and semiconductorlayers 215 can include silicon germanium, where semiconductor layers 210have a first silicon atomic percent and/or a first germanium atomicpercent and semiconductor layers 215 have a second, different siliconatomic percent and/or a second, different germanium atomic percent. Thepresent disclosure contemplates that semiconductor layers 210 andsemiconductor layers 215 include any combination of semiconductormaterials that can provide desired etching selectivity, desiredoxidation rate differences, and/or desired performance characteristics(e.g., materials that maximize current flow), including any of thesemiconductor materials disclosed herein.

As described further below, semiconductor layers 215 or portions thereofform channel regions of multigate device 200. In the depictedembodiment, semiconductor layer stack 205 includes four semiconductorlayers 210 and four semiconductor layers 215 configured to form foursemiconductor layer pairs disposed over substrate 202, eachsemiconductor layer pair having a respective first semiconductor layer210 and a respective second semiconductor layer 215. After undergoingsubsequent processing, such configuration will result in multigatedevice 200 having four channels. However, the present disclosurecontemplates embodiments where semiconductor layer stack 205 includesmore or less semiconductor layers, for example, depending on a number ofchannels desired for multigate device 200 (e.g., a GAA transistor)and/or design requirements of multigate device 200. For example,semiconductor layer stack 205 can include two to ten semiconductorlayers 210 and two to ten semiconductor layers 215. In furtherance ofthe depicted embodiment, semiconductor layers 210 have a thickness t1and semiconductor layers 215 have a thickness t2, where thickness t1 andthickness t2 are chosen based on fabrication and/or device performanceconsiderations for multigate device 200. For example, thickness t1 canbe configured to define a desired distance (or gap) between adjacentchannels of multigate device 200 (e.g., between semiconductor layers215), thickness t2 can be configured to achieve desired thickness ofchannels of multigate device 200, and both thickness t1 and thickness t2can be configured to achieve desired performance of multigate device200. In some embodiments, thickness t1 and thickness t2 are about 1 nmto about 10 nm.

Turning to FIGS. 3A-3D, semiconductor layer stack 205 is patterned toform a fin 218A and a fin 218B (also referred to as fin structures, finelements, etc.). Fins 218, 218B include a substrate portion (i.e., aportion of substrate 202) and a semiconductor layer stack portion (i.e.,a remaining portion of semiconductor layer stack 205 includingsemiconductor layers 210 and semiconductor layers 215). Fins 218A, 218Bextend substantially parallel to one another along a y-direction, havinga length defined in the y-direction, a width defined in an x-direction,and a height defined in a z-direction. In some implementations, alithography and/or etching process is performed to pattern semiconductorlayer stack 205 to form fins 218A, 218B. The lithography process caninclude forming a resist layer over semiconductor layer stack 205 (forexample, by spin coating), performing a pre-exposure baking process,performing an exposure process using a mask, performing a post-exposurebaking process, and performing a developing process. During the exposureprocess, the resist layer is exposed to radiation energy (such asultraviolet (UV) light, deep UV (DUV) light, or extreme UV (EUV) light),where the mask blocks, transmits, and/or reflects radiation to theresist layer depending on a mask pattern of the mask and/or mask type(for example, binary mask, phase shift mask, or EUV mask), such that animage is projected onto the resist layer that corresponds with the maskpattern. Since the resist layer is sensitive to radiation energy,exposed portions of the resist layer chemically change, and exposed (ornon-exposed) portions of the resist layer are dissolved during thedeveloping process depending on characteristics of the resist layer andcharacteristics of a developing solution used in the developing process.After development, the patterned resist layer includes a resist patternthat corresponds with the mask. The etching process removes portions ofsemiconductor layer stack 205 using the patterned resist layer as anetch mask. In some embodiments, the patterned resist layer is formedover a hard mask layer disposed over semiconductor layer stack 205, afirst etching process removes portions of the hard mask layer to form apatterned hard mask layer, and a second etching process removes portionsof semiconductor layer stack 205 using the patterned hard mask layer asan etch mask. The etching process can include a dry etching process, awet etching process, other suitable etching process, or combinationsthereof. In some embodiments, the etching process is a reactive ionetching (RIE) process. After the etching process, the patterned resistlayer (and, in some embodiments, a hard mask layer) is removed, forexample, by a resist stripping process or other suitable process.Alternatively, fins 218A, 218B are formed by a multiple patterningprocess, such as a double patterning lithography (DPL) process (forexample, a lithography-etch-lithography-etch (LELE) process, aself-aligned double patterning (SADP) process, a spacer-is-dielectric(SID) SADP process, other double patterning process, or combinationsthereof), a triple patterning process (for example, alithography-etch-lithography-etch-lithography-etch (LELELE) process, aself-aligned triple patterning (SATP) process, other triple patterningprocess, or combinations thereof), other multiple patterning process(for example, self-aligned quadruple patterning (SAQP) process), orcombinations thereof. In some embodiments, directed self-assembly (DSA)techniques are implemented while patterning semiconductor layer stack205. Further, in some embodiments, the exposure process can implementmaskless lithography, electron-beam (e-beam) writing, and/or ion-beamwriting for patterning the resist layer.

An isolation feature(s) 230 is formed over and/or in substrate 202 toisolate various regions, such as various device regions, of multigatedevice 200. For example, isolation features 230 surround a bottomportion of fins 218A, 218B, such that isolation features 230 separateand isolate fins 218A, 218B from each other. In the depicted embodiment,isolation features 230 surround the substrate portion of fins 218A, 218B(e.g., doped regions 204A, 204B of substrate 202) and partially surroundthe semiconductor layer stack portion of fins 218A, 218B (e.g., aportion of bottommost semiconductor layer 210). However, the presentdisclosure contemplates different configurations of isolation features230 relative to fins 218A, 218B. Isolation features 230 include siliconoxide, silicon nitride, silicon oxynitride, other suitable isolationmaterial (for example, including silicon, oxygen, nitrogen, carbon, orother suitable isolation constituent), or combinations thereof.Isolation features 230 can include different structures, such as shallowtrench isolation (STI) structures, deep trench isolation (DTI)structures, and/or local oxidation of silicon (LOCOS) structures. Forexample, isolation features 230 can include STI features that define andelectrically isolate fins 218A, 218B from other active device regions(such as fins) and/or passive device regions. STI features can be formedby etching a trench in substrate 202 (for example, by using a dryetching process and/or a wet etching process) and filling the trenchwith insulator material (for example, by using a CVD process or aspin-on glass process). A chemical mechanical polishing (CMP) processmay be performed to remove excessive insulator material and/or planarizea top surface of isolation features 230. In another example, STIfeatures can be formed by depositing an insulator material oversubstrate 202 after forming fins 218A, 218B (in some implementations,such that the insulator material layer fills gaps (trenches) betweenfins 218A, 218B) and etching back the insulator material layer to formisolation features 230. In some embodiments, STI features include amulti-layer structure that fills the trenches, such as a silicon nitridecomprising layer disposed over a thermal oxide comprising liner layer.In another example, STI features include a dielectric layer disposedover a doped liner layer (including, for example, boron silicate glass(BSG) or phosphosilicate glass (PSG)). In yet another example, STIfeatures include a bulk dielectric layer disposed over a linerdielectric layer, where the bulk dielectric layer and the linerdielectric layer include materials depending on design requirements.

Turning to FIGS. 4A-4D, gate structures 240 are formed over portions offins 218A, 218B and over isolation features 230. Gate structures 240extend lengthwise in a direction that is different than (e.g.,orthogonal to) the lengthwise direction of fins 218A, 218B. For example,gate structures 240 extend substantially parallel to one another alongthe x-direction, having a length defined in the y-direction, a widthdefined in the x-direction, and a height defined in the z-direction.Gate structures 240 are disposed on portions of fins 218A, 218B anddefine source/drain regions 242 and channel regions 244 of fins 218A,218B. In the X-Z plane, gate structures 240 wrap top surfaces andsidewall surfaces of fins 218A, 218B. In the Y-Z plane, gate structures240 are disposed over top surfaces of respective channel regions 244 offins 218A, 218B, such that gate structures 240 interpose respectivesource/drain regions 242. Each gate structure 240 includes a gate region240-1 that corresponds with a portion of the respective gate structure240 that will be configured for an n-type GAA transistor (and thuscorresponds with a portion spanning an n-type GAA transistor region) anda gate region 240-2 that corresponds with a portion of the respectivegate structure 240 that will be configured for a p-type GAA transistor(and thus corresponds with a portion spanning a p-type GAA transistorregion). Gate structures 240 are configured differently in gate region240-1 and gate region 240-2. For example, as described further below,each metal gate stack of gate structures 240 spans gate region 240-1 andgate region 240-2 and is configured differently in gate region 240-1 andgate region 240-2 to optimize performance of the n-type GAA transistors(having n-gate electrodes in gate regions 240-1) and the p-type GAAtransistors (having p-gate electrodes in gate regions 240-2).Accordingly, gate regions 240-1 will be referred to as n-type gateregions 240-1 and gate regions 240-2 will be referred to as p-type gateregions 240-2 hereinafter.

In FIGS. 4A-4D, each gate structure 240 includes a dummy gate stack 245.In the depicted embodiment, a width of dummy gate stacks 245 defines agate length (L_(g)) of gate structures 240 (here, in the y-direction),where the gate length defines a distance (or length) that current (e.g.,carriers, such as electrons or holes) travels between source/drainregions 242 when the n-type GAA transistor and/or the p-type GAAtransistor are switched (turned) on. In some embodiments, the gatelength is about 5 nm to about 250 nm. Gate length can be tuned toachieve desired operation speeds of the GAA transistors and/or desiredpacking density of the GAA transistors. For example, when a GAAtransistor is switched on, current flows between source/drain regions ofthe GAA transistor. Increasing the gate length increases a distancerequired for current to travel between the source/drain regions,increasing a time it takes for the GAA transistor to switch fully on.Conversely, decreasing the gate length decreases the distance requiredfor current to travel between the source/drain regions, decreasing atime it takes for the GAA transistor to switch fully on. Smaller gatelengths provide GAA transistors that switch on/off more quickly,facilitating faster, high speed operations. Smaller gate lengths alsofacilitate tighter packing density (i.e., more GAA transistors can befabricated in a given area of an IC chip), increasing a number offunctions and applications that can be fabricated on the IC chip. In thedepicted embodiment, the gate length of one or more of gate structures240 is configured to provide GAA transistors having short-length (SC)channels. For example, the gate length of SC GAA transistors is about 5nm to about 20 nm. In some embodiments, multigate device 200 can includeGAA transistors having different gate lengths. For example, a gatelength of one or more of gate structures 240 can be configured toprovide GAA transistors having mid-length or long-length channels(M/LC). In some embodiments, the gate length of M/LC GAA transistors isabout 20 nm to about 250 nm.

Dummy gate stacks 245 include a dummy gate electrode, and in someembodiments, a dummy gate dielectric. The dummy gate electrode includesa suitable dummy gate material, such as polysilicon layer. Inembodiments where dummy gate stacks 245 include a dummy gate dielectricdisposed between the dummy gate electrode and fins 218A, 218B, the dummygate dielectric includes a dielectric material, such as silicon oxide, ahigh-k dielectric material, other suitable dielectric material, orcombinations thereof. Examples of high-k dielectric material includeHfO₂, HfSiO, HfSiON, HfTaO, HfTiO, HfZrO, zirconium oxide, aluminumoxide, hafnium dioxide-alumina (HfO₂—Al₂O₃) alloy, other suitable high-kdielectric materials, or combinations thereof. In some embodiments, thedummy gate dielectric includes an interfacial layer (including, forexample, silicon oxide) disposed over fins 218A, 218B and a high-kdielectric layer disposed over the interfacial layer. Dummy gate stacks245 can include numerous other layers, for example, capping layers,interface layers, diffusion layers, barrier layers, hard mask layers, orcombinations thereof. For example, dummy gate stacks 245 can furtherinclude a hard mask layer disposed over the dummy gate electrode.

Dummy gate stacks 245 are formed by deposition processes, lithographyprocesses, etching processes, other suitable processes, or combinationsthereof. For example, a deposition process is performed to form a dummygate electrode layer over fins 218A, 218B and isolation features 230. Insome embodiments, a deposition process is performed to form a dummy gatedielectric layer over fins 218A, 218B and isolation features 230 beforeforming the dummy gate electrode layer. In such embodiments, the dummygate electrode layer is deposited over the dummy gate dielectric layer.In some embodiment, a hard mask layer is deposited over the dummy gateelectrode layer. The deposition process includes CVD, physical vapordeposition (PVD), atomic layer deposition (ALD), high density plasma CVD(HDPCVD), metal organic CVD (MOCVD), remote plasma CVD (RPCVD), plasmaenhanced CVD (PECVD), low-pressure CVD (LPCVD), atomic layer CVD(ALCVD), atmospheric pressure CVD (APCVD), plating, other suitablemethods, or combinations thereof. A lithography patterning and etchingprocess is then performed to pattern the dummy gate electrode layer(and, in some embodiments, the dummy gate dielectric layer and the hardmask layer) to form dummy gate stacks 245, such that dummy gate stacks245 (including the dummy gate electrode layer, the dummy gate dielectriclayer, the hard mask layer, and/or other suitable layers) is configuredas depicted in FIGS. 4A-4D. The lithography patterning processes includeresist coating (for example, spin-on coating), soft baking, maskaligning, exposure, post-exposure baking, developing the resist,rinsing, drying (for example, hard baking), other suitable lithographyprocesses, or combinations thereof. The etching processes include dryetching processes, wet etching processes, other etching methods, orcombinations thereof.

Each gate structure 240 further includes gate spacers 247 disposedadjacent to (i.e., along sidewalls of) respective dummy gate stacks 245.Gate spacers 247 are formed by any suitable process and include adielectric material. The dielectric material can include silicon,oxygen, carbon, nitrogen, other suitable material, or combinationsthereof (e.g., silicon oxide, silicon nitride, silicon oxynitride(SiON), silicon carbide, silicon carbon nitride (SiCN), siliconoxycarbide (SiOC), silicon oxycarbon nitride (SiOCN)). For example, adielectric layer including silicon and nitrogen, such as a siliconnitride layer, can be deposited over dummy gate stacks 245 andsubsequently etched (e.g., anisotropically etched) to form gate spacers247. In some embodiments, gate spacers 247 include a multi-layerstructure, such as a first dielectric layer that includes siliconnitride and a second dielectric layer that includes silicon oxide. Insome embodiments, more than one set of spacers, such as seal spacers,offset spacers, sacrificial spacers, dummy spacers, and/or main spacers,are formed adjacent to dummy gate stacks 245. In such implementations,the various sets of spacers can include materials having different etchrates. For example, a first dielectric layer including silicon andoxygen (e.g., silicon oxide) can be deposited and etched to form a firstspacer set adjacent to dummy gate stacks 245, and a second dielectriclayer including silicon and nitrogen (e.g., silicon nitride) can bedeposited and etched to form a second spacer set adjacent to the firstspacer set.

Turning to FIGS. 5A-5D, exposed portions of fins 218A, 218B (i.e.,source/drain regions 242 of fins 218A, 218B that are not covered by gatestructures 240) are at least partially removed to form source/draintrenches (recesses) 250. In the depicted embodiment, an etching processcompletely removes semiconductor layer stack 205 in source/drain regions242 of fins 218A, 218B, thereby exposing the substrate portion of fins218A, 218B in source/drain regions 242 (e.g., p-well 204A and n-well204B). Source/drain trenches 250 thus have sidewalls defined byremaining portions of semiconductor layer stack 205, which are disposedin channel regions 244 under gate structures 240, and bottoms defined bysubstrate 202, such as top surfaces of p-well 204A and n-well 204B insource/drain regions 242. In some embodiments, the etching processremoves some, but not all, of semiconductor layer stack 205, such thatsource/drain trenches 250 have bottoms defined by semiconductor layer210 or semiconductor layer 215 in source/drain regions 242. In someembodiments, the etching process further removes some, but not all, ofthe substrate portion of fins 218A, 218B, such that source/drainrecesses 250 extend below a topmost surface of substrate 202. Theetching process can include a dry etching process, a wet etchingprocess, other suitable etching process, or combinations thereof. Insome embodiments, the etching process is a multi-step etch process. Forexample, the etching process may alternate etchants to separately andalternately remove semiconductor layers 210 and semiconductor layers215. In some embodiments, parameters of the etching process areconfigured to selectively etch semiconductor layer stack with minimal(to no) etching of gate structures 240 (i.e., dummy gate stacks 245 andgate spacers 247) and/or isolation features 230. In some embodiments, alithography process, such as those described herein, is performed toform a patterned mask layer that covers gate structures 240 and/orisolation features 230, and the etching process uses the patterned masklayer as an etch mask.

Turning to FIGS. 6A-6D, inner spacers 255 are formed in channel regions244 along sidewalls of semiconductor layers 210 by any suitable process.For example, a first etching process is performed that selectivelyetches semiconductor layers 210 exposed by source/drain trenches 250with minimal (to no) etching of semiconductor layers 215, such that gapsare formed between semiconductor layers 215 and between semiconductorlayers 215 and substrate 202 under gate spacers 247. Portions (edges) ofsemiconductor layers 215 are thus suspended in the channel regions 244under gate spacers 247. In some embodiments, the gaps extend partiallyunder dummy gate stacks 245. The first etching process is configured tolaterally etch (e.g., along the y-direction) semiconductor layers 210,thereby reducing a length of semiconductor layers 210 along they-direction. The first etching process is a dry etching process, a wetetching process, other suitable etching process, or combinationsthereof. A deposition process then forms a spacer layer over gatestructures 240 and over features defining source/drain trenches 250(e.g., semiconductor layers 215, semiconductor layers 210, and substrate202), such as CVD, PVD, ALD, HDPCVD, MOCVD, RPCVD, PECVD, LPCVD, ALCVD,APCVD, plating, other suitable methods, or combinations thereof. Thespacer layer partially (and, in some embodiments, completely) fills thesource/drain trenches 250. The deposition process is configured toensure that the spacer layer fills the gaps between semiconductor layers215 and between semiconductor layers 215 and substrate 202 under gatespacers 247. A second etching process is then performed that selectivelyetches the spacer layer to form inner spacers 255 as depicted in FIGS.6A-6D with minimal (to no) etching of semiconductor layers 215, dummygate stacks 245, and gate spacers 247. In some embodiments, the spacerlayer is removed from sidewalls of gate spacers 247, sidewalls ofsemiconductor layers 215, dummy gate stacks 245, and substrate 202. Thespacer layer (and thus inner spacers 255) includes a material that isdifferent than a material of semiconductor layers 215 and a material ofgate spacers 247 to achieve desired etching selectivity during thesecond etching process. In some embodiments, the spacer layer includes adielectric material that includes silicon, oxygen, carbon, nitrogen,other suitable material, or combinations thereof (for example, siliconoxide, silicon nitride, silicon oxynitride, silicon carbide, or siliconoxycarbonitride). In some embodiments, the spacer layer includes a low-kdielectric material, such as those described herein. In someembodiments, dopants (for example, p-type dopants, n-type dopants, orcombinations thereof) are introduced into the dielectric material, suchthat spacer layer includes a doped dielectric material.

Turning to FIGS. 7A-7D, epitaxial source/drain features are formed insource/drain recesses 250. For example, a semiconductor material isepitaxially grown from portions of substrate 202 and semiconductorlayers 215 exposed by source/drain recesses 250, forming epitaxialsource/drain features 260A in source/drain regions 242 that correspondwith n-type GAA transistor regions and epitaxial source/drain features260B in source/drain regions 242 that correspond with p-type GAAtransistor regions. An epitaxy process can use CVD deposition techniques(for example, VPE and/or UHV-CVD), molecular beam epitaxy, othersuitable epitaxial growth processes, or combinations thereof. Theepitaxy process can use gaseous and/or liquid precursors, which interactwith the composition of substrate 202 and/or semiconductor layer stack205 (in particular, semiconductor layers 215). Epitaxial source/drainfeatures 260A, 260B are doped with n-type dopants and/or p-type dopants.In some embodiments, for the n-type GAA transistors, epitaxialsource/drain features 260A include silicon. Epitaxial source/drainfeatures 260A can be doped with carbon, phosphorous, arsenic, othern-type dopant, or combinations thereof (for example, forming Si:Cepitaxial source/drain features, Si:P epitaxial source/drain features,or Si:C:P epitaxial source/drain features). In some embodiments, for thep-type GAA transistors, epitaxial source/drain features 260B includesilicon germanium or germanium. Epitaxial source/drain features 260B canbe doped with boron, other p-type dopant, or combinations thereof (forexample, forming Si:Ge:B epitaxial source/drain features). In someembodiments, epitaxial source/drain features 260A and/or epitaxialsource/drain features 260B include more than one epitaxial semiconductorlayer, where the epitaxial semiconductor layers can include the same ordifferent materials and/or dopant concentrations. In some embodiments,epitaxial source/drain features 260A, 260B include materials and/ordopants that achieve desired tensile stress and/or compressive stress inrespective channel regions 244. In some embodiments, epitaxialsource/drain features 260A, 260B are doped during deposition by addingimpurities to a source material of the epitaxy process (i.e., in-situ).In some embodiments, epitaxial source/drain features 260A, 260B aredoped by an ion implantation process subsequent to a deposition process.In some embodiments, annealing processes (e.g., rapid thermal annealing(RTA) and/or laser annealing) are performed to activate dopants inepitaxial source/drain features 260A, 260B and/or other source/drainregions (for example, heavily doped source/drain regions and/or lightlydoped source/drain (LDD) regions). In some embodiments, epitaxialsource/drain features 260A, 260B are formed in separate processingsequences that include, for example, masking p-type GAA transistorregions when forming epitaxial source/drain features 260A in n-type GAAtransistor regions and masking n-type GAA transistor regions whenforming epitaxial source/drain features 260B in p-type GAA transistorregions.

Turning to FIGS. 8A-8D, an inter-level dielectric (ILD) layer 270 isformed over isolation features 230, epitaxial source/drain features260A, 260B, and gate spacers 247, for example, by a deposition process(such as CVD, PVD, ALD, HDPCVD, MOCVD, RPCVD, PECVD, LPCVD, ALCVD,APCVD, plating, other suitable methods, or combinations thereof). ILDlayer 270 is disposed between adjacent gate structures 240. In someembodiments, ILD layer 270 is formed by a flowable CVD (FCVD) processthat includes, for example, depositing a flowable material (such as aliquid compound) over multigate device 200 and converting the flowablematerial to a solid material by a suitable technique, such as thermalannealing and/or ultraviolet radiation treating. ILD layer 270 includesa dielectric material including, for example, silicon oxide, siliconnitride, silicon oxynitride, TEOS formed oxide, PSG, BPSG, low-kdielectric material, other suitable dielectric material, or combinationsthereof. Exemplary low-k dielectric materials include FSG, carbon dopedsilicon oxide, Black Diamond® (Applied Materials of Santa Clara,Calif.), Xerogel, Aerogel, amorphous fluorinated carbon, Parylene, BCB,SILK (Dow Chemical, Midland, Mich.), polyimide, other low-k dielectricmaterial, or combinations thereof. In the depicted embodiment, ILD layer270 is a dielectric layer that includes a low-k dielectric material(generally referred to as a low-k dielectric layer). ILD layer 270 caninclude a multilayer structure having multiple dielectric materials. Insome embodiments, a contact etch stop layer (CESL) is disposed betweenILD layer 270 and isolation features 230, epitaxial source/drainfeatures 260A, 260B, and gate spacers 247. The CESL includes a materialdifferent than ILD layer 270, such as a dielectric material that isdifferent than the dielectric material of ILD layer 270. For example,where ILD layer 270 includes a low-k dielectric material, the CESLincludes silicon and nitrogen, such as silicon nitride or siliconoxynitride. Subsequent to the deposition of ILD layer 270 and/or theCESL, a CMP process and/or other planarization process can be performeduntil reaching (exposing) a top portion (or top surface) of dummy gatestacks 245. In some embodiments, the planarization process removes hardmask layers of dummy gate stacks 245 to expose underlying dummy gateelectrodes of dummy gate stacks 245, such as polysilicon gate electrodelayers.

ILD layer 170 may be a portion of a multilayer interconnect (MLI)feature disposed over substrate 202. The MLI feature electricallycouples various devices (for example, p-type GAA transistors and/orn-type GAA transistors of multigate device 200, transistors, resistors,capacitors, and/or inductors) and/or components (for example, gatestructures and/or epitaxial source/drain features of p-type GAAtransistors and/or n-type GAA transistors), such that the variousdevices and/or components can operate as specified by designrequirements of multigate device 200. The MLI feature includes acombination of dielectric layers and electrically conductive layers(e.g., metal layers) configured to form various interconnect structures.The conductive layers are configured to form vertical interconnectfeatures, such as device-level contacts and/or vias, and/or horizontalinterconnect features, such as conductive lines. Vertical interconnectfeatures typically connect horizontal interconnect features in differentlayers (or different planes) of the MLI feature. During operation, theinterconnect features are configured to route signals between thedevices and/or the components of multigate device 200 and/or distributesignals (for example, clock signals, voltage signals, and/or groundsignals) to the devices and/or the components of multigate device 200.

Turning to FIGS. 9A-9D, dummy gate stacks 245 are removed from gatestructures 240, thereby exposing semiconductor layer stacks 205 of fins218A, 218B in n-type gate regions 240-1 and p-type gate regions 240-2.In the depicted embodiment, an etching process completely removes dummygate stacks 245 to expose semiconductor layers 215 and semiconductorlayers 210 in channel regions 244. The etching process is a dry etchingprocess, a wet etching process, other suitable etching process, orcombinations thereof. In some embodiments, the etching process is amulti-step etch process. For example, the etching process may alternateetchants to separately remove various layers of dummy gate stacks 245,such as the dummy gate electrode layers, the dummy gate dielectriclayers, and/or the hard mask layers. In some embodiments, the etchingprocess is configured to selectively etch dummy gate stacks 245 withminimal (to no) etching of other features of multigate device 200, suchas ILD layer 270, gate spacers 247, isolation features 230,semiconductor layers 215, and semiconductor layers 210. In someembodiments, a lithography process, such as those described herein, isperformed to form a patterned mask layer that covers ILD layer 270and/or gate spacers 247, and the etching process uses the patterned masklayer as an etch mask.

Turning to FIGS. 10A-10D, semiconductor layers 210 of semiconductorlayer stack 205 (exposed by gate trenches 275) are selectively removedfrom channel regions 244, thereby forming suspended semiconductor layers215′ in channel regions 244. In the depicted embodiment, an etchingprocess selectively etches semiconductor layers 210 with minimal (to no)etching of semiconductor layers 215 and, in some embodiments, minimal(to no) etching of gate spacers 247 and/or inner spacers 255. Variousetching parameters can be tuned to achieve selective etching ofsemiconductor layers 210, such as etchant composition, etchingtemperature, etching solution concentration, etching time, etchingpressure, source power, RF bias voltage, RF bias power, etchant flowrate, other suitable etching parameters, or combinations thereof. Forexample, an etchant is selected for the etching process that etches thematerial of semiconductor layers 210 (in the depicted embodiment,silicon germanium) at a higher rate than the material of semiconductorlayers 215 (in the depicted embodiment, silicon) (i.e., the etchant hasa high etch selectivity with respect to the material of semiconductorlayers 210). The etching process is a dry etching process, a wet etchingprocess, other suitable etching process, or combinations thereof. Insome embodiments, a dry etching process (such as an RIE process)utilizes a fluorine-containing gas (for example, SF₆) to selectivelyetch semiconductor layers 210. In some embodiments, a ratio of thefluorine-containing gas to an oxygen-containing gas (for example, O₂),an etching temperature, and/or an RF power may be tuned to selectivelyetch silicon germanium or silicon. In some embodiments, a wet etchingprocess utilizes an etching solution that includes ammonium hydroxide(NH₄OH) and water (H₂O) to selectively etch semiconductor layers 210. Insome embodiments, a chemical vapor phase etching process usinghydrochloric acid (HCl) selectively etches semiconductor layers 210.

At least one suspended semiconductor layer 215′ is thus exposed inn-type gate regions 240-1 and p-type gate regions 240-2 by gate trenches275. In the depicted embodiment, each n-type gate region 240-1 and eachp-type gate region 240-2 includes four suspended semiconductor layers215′ vertically stacked that will provide four channels through whichcurrent will flow between respective epitaxial source/drain features(epitaxial source/drain features 260A or epitaxial source/drain features260B) during operation of the GAA transistors. Suspended semiconductorlayers 215′ are thus referred to as channel layers 215′ hereinafter.Channel layers 215′ in n-type gate regions 240-1 are separated by gaps277A, and channel layers 215′ in p-type gate regions 240-2 are separatedby gaps 277B. Channel layers 215′ in n-type gate regions 240-1 are alsoseparated from substrate 202 by gaps 277A, and channel layers 215′ inp-type gate regions 240-2 are also separated from substrate 202 by gaps277B. A spacing s1 is defined between channel layers 215′ along thez-direction in n-type gate regions 240-1, and a spacing s2 is definedbetween channel layers 215′ along the z-direction in p-type gate regions240-2. Spacing s1 and spacing s2 correspond with a width of gaps 277Aand gaps 277B, respectively. In the depicted embodiment, spacing s1 isabout equal to s2, though the present disclosure contemplatesembodiments where spacing s1 is different than spacing s2. In someembodiments, spacing s1 and spacing s2 are both about equal to thicknesst1 of semiconductor layers 210. Further, channel layers 215′ in n-typegate regions 240-1 have a length 11 along the x-direction and a width w1along the y-direction, and channel layers 215′ in p-type gate regions240-2 have a length 12 along the y-direction and a width w2 along thex-direction. In the depicted embodiment, length 11 is about equal tolength 12, and width w1 is about equal to width w2, though the presentdisclosure contemplates embodiments where length 11 is different thanlength 12 and/or width w1 is different than width w2. In someembodiments, length 11 and/or length 12 is about 10 nm to about 50 nm.In some embodiments, width w1 and/or width w2 is about 4 nm to about 10nm. In some embodiments, each channel layer 215′ has nanometer-sizeddimensions and can be referred to as a “nanowire,” which generallyrefers to a channel layer suspended in a manner that will allow a metalgate to physically contact at least two sides of the channel layer, andin GAA transistors, will allow the metal gate to physically contact atleast four sides of the channel layer (i.e., surround the channellayer). In such embodiments, a vertical stack of suspended channellayers can be referred to as a nanostructure, and the process depictedin FIGS. 10A-10D can be referred to as a channel nanowire releaseprocess. In some embodiments, after removing semiconductor layers 210,an etching process is performed to modify a profile of channel layers215′ to achieve desired dimensions and/or desired shapes (e.g.,cylindrical-shaped (e.g., nanowire), rectangular-shaped (e.g., nanobar),sheet-shaped (e.g., nanosheet), etc.). The present disclosure furthercontemplates embodiments where the channel layers 215′ (nanowires) havesub-nanometer dimensions depending on design requirements of multigatedevice 200.

Turning to FIGS. 11A-11D, a gate dielectric layer is formed overmultigate device 200, where the gate dielectric layer partially fillsgate trenches 275 and wraps (surrounds) channel layers 215′ in n-typegate regions 240-1 and p-type gate regions 240-2 of gate structures 240.In the depicted embodiment, the gate dielectric layer includes aninterfacial layer 280 and a high-k dielectric layer 282, whereinterfacial layer 280 is disposed between the high-k dielectric layer282 and channel layers 215′. In furtherance of the depicted embodiment,interfacial layer 280 and high-k dielectric layer 282 partially fillgaps 277A between channel layers 215′ and between channel layers 215′and substrate 202 in n-type gate regions 240-1 and partially fill gaps277B between channel layers 215′ and between channel layers 215′ andsubstrate 202 in p-type gate regions 240-2. In some embodiments,interfacial layer 280 and/or high-k dielectric layer 282 are alsodisposed on substrate 202, isolation features 230, and/or gate spacers247. Interfacial layer 280 includes a dielectric material, such as SiO₂,HfSiO, SiON, other silicon-comprising dielectric material, othersuitable dielectric material, or combinations thereof. High-k dielectriclayer 282 includes a high-k dielectric material, such as HfO₂, HfSiO,HfSiO₄, HfSiON, HfLaO, HfTaO, HfTiO, HfZrO, HfAlO_(x), ZrO, ZrO₂,ZrSiO₂, AlO, AlSiO, Al₂O₃, TiO, TiO₂, LaO, LaSiO, Ta₂O₃, Ta₂O₅, Y₂O₃,SrTiO₃, BaZrO, BaTiO₃ (BTO), (Ba,Sr)TiO₃ (BST), Si₃N₄, hafniumdioxide-alumina (HfO₂—Al₂O₃) alloy, other suitable high-k dielectricmaterial, or combinations thereof. High-k dielectric material generallyrefers to dielectric materials having a high dielectric constant, forexample, greater than that of silicon oxide (k≈3.9). Interfacial layer280 is formed by any of the processes described herein, such as thermaloxidation, chemical oxidation, ALD, CVD, other suitable process, orcombinations thereof. In some embodiments, interfacial layer 280 has athickness of about 0.5 nm to about 3 nm. High-k dielectric layer 282 isformed by any of the processes described herein, such as ALD, CVD, PVD,oxidation-based deposition process, other suitable process, orcombinations thereof. In some embodiments, high-k dielectric layer 282has a thickness of about 1 nm to about 2 nm.

Turning to FIGS. 12A-12D, a sacrificial (dummy) layer 284 is depositedover multigate device 200, where sacrificial layer 284 partially fillsgate trenches 275 and wraps (surrounds) channel layers 215′ in n-typegate regions 240-1 and p-type gate regions 240-2. For example,sacrificial layer 284 is deposited on the gate dielectric layer by anyof the processes described herein, such as ALD, CVD, PVD, other suitableprocess, or combinations thereof. In the depicted embodiment,sacrificial layer 284 is disposed on high-k dielectric layer 282 andsurrounds high-k dielectric layer 282, interfacial layer 280, andchannel layers 215′. For example, sacrificial layer 284 is disposedalong sidewalls, tops, and bottoms of channel layers 215′. A thicknessof sacrificial layer 284 is configured to fill any remaining portion ofgaps 277A between channel layers 215′ in n-type gate regions 240-1 andany remaining portion of gaps 277B between channel layers 215′ in p-typegate regions 240-2 without filling gate trenches 275 (i.e., any portionsof gaps 277A, 277B not filled by the gate dielectric layer). In someembodiments, the thickness of sacrificial layer 284 is about 0.5 nm toabout 5 nm. Sacrificial layer 284 includes a material that is differentthan a high-k dielectric material to achieve etching selectivity betweensacrificial layer 284 and high-k dielectric layer 282 during an etchingprocess, such that sacrificial layer 284 can be selectively etched withminimal (to no) etching of high-k dielectric layer 282. The material ofsacrificial layer 284 is also different than a p-type work functionmaterial of a p-type work function layer (e.g., formed later as aportion of the gate electrodes of gate structures 240) to achieveetching selectivity between sacrificial layer 284 and the p-type workfunction layer during an etching process, such that sacrificial layer284 can be selectively etched with minimal (to no) etching of the p-typework function layer, and vice versa. The material of sacrificial layer284 may also be different than a low-k dielectric material to achieveetching selectivity between sacrificial layer 284 and low-k dielectricmaterial, such as that of ILD layer 270, during an etching process, suchthat sacrificial layer 284 can be selectively etched with minimal (tono) etching of ILD layer 270. In some embodiments, sacrificial layer 284includes metal and oxygen (and can thus be referred to as a metal oxidelayer), such as aluminum and oxygen (e.g., AlO_(x)). In someembodiments, sacrificial layer 284 includes polysilicon. In someembodiments, sacrificial layer 284 includes silicon. In someembodiments, sacrificial layer 284 includes a dielectric material thatincludes silicon, such as SiO₂, SiN, SiON, other suitable dielectricmaterial including silicon, or combinations thereof. The presentdisclosure contemplates sacrificial layer 284 including othersemiconductor materials and/or other dielectric materials that canprovide the desired etching selectivity as described herein.

Turning to FIGS. 13A-13D, an etching process is performed to partiallyremove sacrificial layer 284, such that sacrificial layer 284 ispatterned into sacrificial (dummy) features 284′ between channel layers215′ and between channel layers 215′ and substrate 202 in n-type gateregions 240-1 and p-type gate regions 240-2. In some embodiments, theetching process is a wet etching process that uses an etching solutionhaving a high etching selectivity with respect to sacrificial layer 284relative to high-k dielectric layer 282. In some embodiments, theetching solution exhibits an etching selectivity (i.e., a ratio of anetch rate of sacrificial layer 284 to the etching solution to an etchrate of high-k dielectric layer 282 to the etching solution) of about 10to about 100. In some embodiments, the etching selectivity is greaterthan or equal to 100. In some embodiments, the wet etching processimplements an NH₄OH-based wet etching solution. Parameters of theetching process are controlled (tuned) to remove sacrificial layer 284from sidewalls of channel layers 215′ and from over isolation features230 with minimal (to no) etching of high-k dielectric layer 282, such asetching temperature, etching solution concentration, etching time, othersuitable wet etching parameters, or combinations thereof. For example,an etching time (i.e., how long sacrificial layer 284 is exposed to theammonia-based wet etching solution) is tuned to remove sacrificial layer284 along sidewalls of channel layers 215′ and along a topmost portionof high-k dielectric layer 282 (i.e., a portion of high-k dielectriclayer 282 that is disposed over a top surface of a topmost channel layer215′). In furtherance of the example, the etching time is further tunedto achieve lateral etching (e.g., along the x-direction and/or they-direction) of sacrificial layer 284 until a width of the sacrificialfeatures 284′ (here, along the x-direction) is less than a sum of thewidth of channel layers 215′ and a thickness of the gate dielectric(here, a sum of the thickness of interfacial layer 280 and the thicknessof high-k dielectric layer 282). In some embodiments, a width ofsacrificial features 284′ is substantially equal to a width of channellayers 215′. Sidewalls of sacrificial features 284′ are thus recessed adistance d along the x-direction relative to sidewalls of high-kdielectric layer 282. In some embodiments, distance d is greater than 0,for example, about 0.5 nm to about 5 nm. In some embodiments, sidewallsof sacrificial features 284′ are not recessed along the x-directionrelative to sidewalls of high-k dielectric layer 282, such that distanced is equal to 0.

Turning to FIGS. 14A-14D, sacrificial features 284′ are removed fromp-type gate regions 240-2 by implementing a lithography process and anetching process. For example, a patterned mask layer 290 having one ormore openings 292 is formed over multigate device 200 by the lithographyprocess. Patterned mask layer 290 covers n-type GAA transistor regions,which include n-type gate regions 240-1. Patterned mask layer 290includes a material that is different than a material of sacrificialfeatures 284′ and a material of high-k dielectric layer 282 to achieveetching selectivity during removal of sacrificial features 284′. Forexample, patterned mask layer 290 includes a resist material (and thusmay be referred to as a patterned resist layer and/or a patternedphotoresist layer). In some embodiments, patterned mask layer 290 has amulti-layer structure, such as a resist layer disposed over ananti-reflective coating (ARC) layer. The present disclosure contemplatesother materials for patterned mask layer 290, so long as etchingselectivity is achieved during removal of sacrificial features 284′. Insome embodiments, the lithography process includes forming a resistlayer over multigate device 200 (e.g., by spin coating), performing apre-exposure baking process, performing an exposure process using amask, performing a post-exposure baking process, and performing adeveloping process. During the exposure process, the resist layer isexposed to radiation energy (e.g., UV light, DUV light, or EUV light),where the mask blocks, transmits, and/or reflects radiation to theresist layer depending on a mask pattern of the mask and/or mask type(e.g., binary mask, phase shift mask, or EUV mask), such that an imageis projected onto the resist layer that corresponds with the maskpattern. Since the resist layer is sensitive to radiation energy,exposed portions of the resist layer chemically change, and exposed (ornon-exposed) portions of the resist layer are dissolved during thedeveloping process depending on characteristics of the resist layer andcharacteristics of a developing solution used in the developing process.After development, the patterned resist layer (e.g., patterned masklayer 290) includes a resist pattern that corresponds with the mask,where the patterned resist layer covers the n-type GAA transistorregions, which include n-type gate regions 240-1, and exposes the p-typeGAA transistor regions, which include p-type gate regions 240-2.Alternatively, the exposure process can be implemented or replaced byother methods, such as maskless lithography, e-beam writing, ion-beamwriting, or combinations thereof.

The etching process then uses patterned mask layer 290 as an etch maskwhen removing sacrificial features 284′ between channel layers 215′ andbetween channel layers 215′ and substrate 202, thereby exposing high-kdielectric layer 282 in p-type gate regions 240-2. The etching processessentially re-forms a portion of gaps 277B in p-type gate regions240-2. In some embodiments, the etching process is a wet etching processthat uses an etching solution having a high etching selectivity withrespect to sacrificial features 284′ relative to high-k dielectric layer282. In some embodiments, the etching solution exhibits an etchingselectivity of about 10 to about 100. In some embodiments, the etchingselectivity is greater than or equal to 100. In some embodiments, thewet etching process implements an NH₄OH-based wet etching solution.Parameters of the etching process are controlled to ensure completeremoval of sacrificial features 284′ in p-type gate regions 240-2, suchas etching temperature, etching solution concentration, etching time,other suitable wet etching parameters, or combinations thereof. Forexample, an etching time (i.e., how long sacrificial features 284′ areexposed to the ammonia-based wet etching solution) is tuned tocompletely remove sacrificial features 284′ with minimal (to no) etchingof high-k dielectric layer 282. In some embodiments, an etching time forcompletely removing sacrificial features 284′ is greater than an etchingtime for patterning sacrificial layer 284 into sacrificial features284′. In some embodiments, the etching solution further has an etchingselectivity with respect to sacrificial features 284′ relative topatterned mask layer 290. In some embodiments, the etching processpartially etches patterned mask layer 290. After the etching process,the patterned mask layer 290 can be removed from multigate device 200,for example, by a resist stripping process or other suitable process.

Turning to FIGS. 15A-15D, a p-type work function layer 300 is formedover multigate device 200, particularly over high-k dielectric layer282. For example, an ALD process conformally deposits p-type workfunction layer 300 on high-k dielectric layer 282, such that p-type workfunction layer 300 has a substantially uniform thickness and partiallyfills gate trenches 275. In p-type gate regions 240-2, p-type workfunction layer 300 is disposed on high-k dielectric layer 282 andsurrounds high-k dielectric layer 282, interfacial layer 280, andchannel layers 215′. For example, p-type work function layer 300 isdisposed along sidewalls, tops, and bottoms of channel layers 215′. Athickness of p-type work function layer 300 is configured to at leastpartially fill gaps 277B between channel layers 215′ and between channellayers 215′ and substrate 202 (and, in some embodiments, without fillinggate trenches 275 along the gate length direction (here, along they-direction)). In some embodiments, p-type work function layer 300 has athickness of about 1 nm to about 10 nm. In contrast, in n-type gateregions 240-1, p-type work function layer 300 is disposed alongsidewalls of channel layers 215′ and the top surfaces of the topmostchannel layers 215′. Sacrificial features 284′ thus function asdeposition stop layers, preventing significant deposition of p-type workfunction layer 300 in gaps 277A between channel layers 215′ and betweenchannel layers 215′ and substrate 202 in n-type gate regions 240-1. Inthe depicted embodiment, p-type work function layer 300 is furtherdisposed along sidewalls of sacrificial features 284′. P-type workfunction layer 300 includes any suitable p-type work function material,such as TiN, TaN, TaSN, Ru, Mo, Al, WN, WCN ZrSi₂, MoSi₂, TaSi₂, NiSi₂,other p-type work function material, or combinations thereof. In thedepicted embodiment, p-type work function layer 300 includes titaniumand nitrogen, such as TiN. P-type work function layer 300 can be formedusing another suitable deposition process, such as CVD, PVD, HDPCVD,MOCVD, RPCVD, PECVD, LPCVD, ALCVD, APCVD, spin coating, plating, otherdeposition process, or combinations thereof.

Turning to FIGS. 16A-16D, p-type work function layer 300 is removed fromn-type gate regions 240-1 of gate structures 240, for example, byimplementing a lithography process and an etching process. For example,a patterned mask layer 310 having one or more openings 312 is formedover multigate device 200 by the lithography process, such as thelithography process described above to form patterned mask layer 290.Patterned mask layer 310 covers p-type gate regions 240-2 of gatestructures 240. Patterned mask layer 310 includes a material that isdifferent than a material of p-type work function layer 300, a materialof sacrificial features 284,′ and a material of high-k dielectric layer282 to achieve etching selectivity during removal of p-type workfunction layer 300. For example, patterned mask layer 310 includes aresist material. In some embodiments, patterned mask layer 310 has amulti-layer structure, such as a resist layer disposed over an ARClayer. The present disclosure contemplates other materials for patternedmask layer 310, so long as etching selectivity is achieved duringremoval of p-type work function layer 300 from n-type gate regions240-1.

Any suitable process is then used to completely remove p-type workfunction layer 300 from n-type gate regions 240-1, thereby exposinghigh-k dielectric layer 282 in n-type gate regions 240-1. In someembodiments, the etching process is a wet etching process that uses anetching solution having a high etching selectivity with respect top-type work function layer 300 relative to high-k dielectric layer 282and sacrificial features 284′. In some embodiments, the etching solutionexhibits an etching selectivity (i.e., a ratio of an etch rate of p-typework function layer 300 to the etching solution to an etch rate ofhigh-k dielectric layer 282 (and/or sacrificial features 284′) to theetching solution) of about 10 to about 100. In some embodiments, theetching selectivity is greater than or equal to 100. In someembodiments, the wet etching process implements a wet etching solutionthat includes NH₄OH, HCl, and diazine (N₂H₂) (in other words, anNH₄OH:HCl:N₂H₂ solution). Parameters of the etching process arecontrolled (tuned) to remove p-type work function layer 300 with minimal(to no) etching of high-k dielectric layer 282 and/or sacrificialfeatures 284′, such as etching temperature, etching solutionconcentration, etching time, other suitable wet etching parameters, orcombinations thereof. In some embodiments, the wet etching solutionincludes NH₄OH, hydrogen peroxide (H₂O₂), sulfuric acid (H₂SO₄),tetramethylammonium hydroxide (TMAH), HCl, other suitable wet etchingsolution, or combinations thereof. For example, the wet etching solutioncan utilize an NH₄OH:H₂O₂ solution, an HCl:H₂O₂:H₂O solution (known asan hydrochloric-peroxide mixture (HPM)), an NH₄OH:H₂O₂:H₂O solution(known as an ammonia-peroxide mixture (APM)), or an H₂SO₄:H₂O₂ solution(known as a sulfuric peroxide mixture (SPM)). In some embodiments, a dryetching process or combination of a dry etching process and a wetetching process is implemented for removing p-type work function layer300. After the etching process, the patterned mask layer 310 can beremoved from multigate device 200, for example, by a resist strippingprocess or other suitable process.

In some embodiments, the etching process is not an over etching process,which generally refers to an etching process that is performed for alonger time than a required, expected etching time to remove a givenmaterial. In conventional GAA gate replacement processes, an overetching process is often required to completely remove p-type workfunction layer 300 from n-type gate regions 240-1, particularly frombetween channel layers 215′ and between channel layers 215′ andsubstrate 202. However, it has been observed that the over etchingprocess may undesirably laterally etch a portion of the p-type workfunction layer 300 in p-type gate regions 240-2 underneath patternedmask layer 310 at a boundary 315 between n-type gate regions 240-1 andp-type gate regions 240-2 (often referred to as an n/p boundary or mixedthreshold voltage boundary). One solution to mitigate the metal gatelateral loss at boundary 315 is to limit a thickness of the p-type workfunction layer 300, which limits threshold voltage tuning of the p-typeGAA transistors. The proposed GAA gate replacement process overcomessuch problems by forming sacrificial features 284′ between channellayers 215′ and between channel layers 215′ and substrate 202 in n-typegate regions 240-1 before forming p-type work function layers of thegate electrodes. This eliminates the need for an over etching process toremove p-type work function layers from between channel layers 215′ andbetween channel layers 215′ and substrate 202 in n-type gate regions240-2, such as p-type work function layer 300, and allows for thickerp-type work function layers in p-type gate regions 240-2, increasingthreshold voltage tuning flexibility for p-type GAA transistors andavoiding unintended increases in the threshold voltages of p-type GAAtransistors. For example, in some embodiments, the etching time of theetching process for removing p-type work function layer 300 is notconfigured to ensure removal of p-type work function material betweenchannel layers 215′ and between channel layers 215′ and substrate 202 inn-type gate regions 240-1. Different embodiments may have differentadvantages, and no particular advantage is necessarily required of anyembodiment.

The processes described with reference to FIGS. 15A-15D and FIGS.16A-16D can be referred to as a p-type work function layerdeposition/etch cycle, which the present disclosure proposes repeatinguntil the gate dielectric and the p-type work function layer completelyfill the gate trenches 275 along the gate length direction in p-typegate regions 240-2 of gate structures 240. For example, in FIG. 15D andFIG. 16D, gate trenches 275 in p-type gate regions 240-2 are notcompletely filled along the gate length direction by interfacial layer280, high-k dielectric layer 282, and p-type work function layer 300.Additional p-type work function layer deposition/etch cycles aretherefore performed until gate trenches 275 in p-type gate regions 240-2are completely filled along the gate length direction by interfaciallayer 280, high-k dielectric layer 282, and a p-type work function layer(including p-type work function layer 300). In some embodiments, p-typework function layer deposition/etch cycles are performed until athickness T of the combined p-type work function layers is greater thanor equal to about half of the gate length (i.e., T≥0.5L_(g)), wherethickness T is defined between sidewalls of high-k dielectric layer 282and sidewalls of the p-type work function layer (both of which aredisposed along sidewalls of channel layers 215′). Completely fillinggate trenches 275 in p-type gate regions 240-1 along the gate lengthdirection ensures that subsequently formed n-type work function layersare formed above the gate structures 240 (in particular, over gatespacers 247) along the gate length direction, such that p-type gateregions 240-2 do not include remnants of n-type work function layersalong the gate length direction, which can adversely alter desiredthreshold voltages of p-type GAA transistors of p-type gate regions240-2. Different embodiments may have different advantages, and noparticular advantage is necessarily required of any embodiment.

Turning to FIGS. 17A-17D, a p-type work function layer 320 is formedover multigate device 200, particularly over high-k dielectric layer 282in n-type gate regions 240-1 of gate structures 240 and over p-type workfunction layer 300 in p-type gate regions 240-2 of gate structures 240.For example, an ALD process conformally deposits p-type work functionlayer 320 on high-k dielectric layer 282 and p-type work function layer300, such that p-type work function layer 320 has a substantiallyuniform thickness and partially fills gate trenches 275 along the gatelength direction in n-type gate regions 240-1 and completely fills anyremaining portions of gate trenches along the gate length direction inp-type gate regions 240-2. In p-type gate regions 240-2, p-type workfunction layer 320 is disposed on p-type work function layer 300 andsurrounds p-type work function layer 300, high-k dielectric layer 282,interfacial layer 280, and channel layers 215′. For example, p-type workfunction layer 320 is disposed along sidewalls, tops, and bottoms ofchannel layers 215′. A thickness of p-type work function layer 320 isconfigured to fill any remaining portions of gaps 277B between channellayers 215′ and between channel layers 215′ and substrate 202. In someembodiments, p-type work function layer 320 has a thickness of about 1nm to about 10 nm. In the depicted embodiment, thickness T (i.e., a sumof a thickness of p-type work function layer 300 and a thickness ofp-type work function layer 320) is greater than or equal to about halfof the gate length (i.e., T≥0.5L_(g)). In some embodiments, thickness Tis about 2 nm to about 20 nm. In contrast, in n-type gate regions 240-1of gate structures 240, p-type work function layer 320 is disposed alongsidewalls of channel layer 215′ and the top surface of the topmostchannel layer 215′. Sacrificial features 284′ thus again function asdeposition stop layers, preventing significant deposition of p-type workfunction layer 320 between channel layers 215′ and between channellayers 215′ and substrate 202 in n-type gate regions 240-1. In thedepicted embodiment, p-type work function layer 320 is disposed alongsidewalls of sacrificial features 284′. P-type work function layer 320includes any suitable p-type work function material, such as TiN, TaN,TaSN, Ru, Mo, Al, WN, WCN ZrSi₂, MoSi₂, TaSi₂, NiSi₂, other p-type workfunction material, or combinations thereof. In the depicted embodiment,p-type work function layer 320 includes titanium and nitrogen, such asTiN. P-type work function layer 320 can be formed using another suitabledeposition process, such as CVD, PVD, HDPCVD, MOCVD, RPCVD, PECVD,LPCVD, ALCVD, APCVD, spin coating, plating, other deposition process, orcombinations thereof.

Turning to FIGS. 18A-18D, p-type work function layer 320 is removed fromn-type gate regions 240-1 of gate structures 240, for example, byimplementing a lithography process and an etching process. For example,a patterned mask layer 330 having one or more openings 332 is formedover multigate device 200 by the lithography process, such as thelithography process described above to form patterned mask layer 290.Patterned mask layer 330 covers p-type gate regions 240-2 of gatestructures 240. Patterned mask layer 330 includes a material that isdifferent than a material of p-type work function layer 320, a materialof sacrificial features 284,′ and a material of high-k dielectric layer282 to achieve etching selectivity during removal of p-type workfunction layer 320. For example, patterned mask layer 330 includes aresist material. In some embodiments, patterned mask layer 330 has amulti-layer structure, such as a resist layer disposed over an ARClayer. The present disclosure contemplates other materials for patternedmask layer 330, so long as etching selectivity is achieved duringremoval of p-type work function layer 320 from n-type gate regions240-1. Any suitable process, such as the etching processes describedabove for removing p-type work function layer 300, is then used tocompletely remove p-type work function layer 320 from n-type gateregions 240-1, thereby exposing high-k dielectric layer 282 in n-typegate regions 240-1. In some embodiments, patterned mask layer 330 mayintentionally or unintentionally (e.g., resulting from overlay shiftassociated with the lithography process) cover a portion of n-type gateregions 240-1 at boundary 315 as depicted in FIG. 18B. This results inthe p-type work function layer having different thicknesses (e.g., alongthe z-direction) at boundary 315, such as a thickness t3 and a thicknesst4. In some embodiments, a difference between thickness t4 (e.g., a sumof the thickness of p-type work function layer 300 and the thickness ofp-type work function layer 320) and thickness t3 (substantially equal tothe thickness of p-type work function layer 300) is greater than orequal to about 1 nm. After the etching process, the patterned mask layer330 can be removed from multigate device 200, for example, by a resiststripping process or other suitable process.

Turning to FIGS. 19A-19D, sacrificial features 284′ are removed fromn-type gate regions 240-1 of gate structures 240 by implementing anetching process. In the depicted embodiment sacrificial features 284′are removed from between channel layers 215′ and between channel layers215′ and substrate 202, thereby exposing high-k dielectric layer 282 inn-type gate regions 240-1. The etching process essentially re-forms aportion of gaps 277A in in n-type gate regions 240-1. In someembodiments, the etching process is a wet etching process that uses anetching solution having a high etching selectivity with respect tosacrificial features 284′ relative to high-k dielectric layer 282 andp-type work function layer 330. In some embodiments, the etchingsolution exhibits an etching selectivity of about 10 to about 100. Insome embodiments, the etching selectivity is greater than or equal to100. In some embodiments, the wet etching process implements anNH₄OH-based wet etching solution. Parameters of the etching process arecontrolled to ensure complete removal of sacrificial features 284′ inn-type gate regions 240-1, such as etching temperature, etching solutionconcentration, etching time, other suitable wet etching parameters, orcombinations thereof. For example, an etching time (i.e., how longsacrificial features 284′ are exposed to the ammonia-based wet etchingsolution) is tuned to completely remove sacrificial features 284′ withminimal (to no) etching of high-k dielectric layer 282 and p-type workfunction layer 330. In some embodiments, an etching time for completelyremoving sacrificial features 284′ is greater than an etching time forpatterning sacrificial layer 284 into sacrificial features 284′. In someembodiments, an etching time for completely removing sacrificialfeatures 284′ from between channel layers 215′ and from between channellayers 215′ and substrate 202 is greater than an etching time that wouldbe required to remove a material of sacrificial features 284′ from overportions of the gate dielectric layer disposed over ILD layer 270, gatespacers 247, and/or isolation features 230. The etching process can thusbe configured as an over etching process to ensure complete removal ofsacrificial features 284′ 248. Etching solutions implemented for theover etching process are configured to have high etching selectivity tosacrificial features 284′ relative to p-type work function layers 300,320 to reduce (or eliminate) concerns of lateral loss of p-type workfunction layers 300, 320 in p-type gate regions 240-2 at boundary 315.In some embodiments, the etching solution further has an etchingselectivity with respect to sacrificial features 284′ relative to apatterned mask layer. In some embodiments, the etching process partiallyremoves (etches) patterned mask layer. In some embodiments, patternedmask layer 330 remains over p-type gate regions 240-2 during removal ofsacrificial features 284′ from n-type gate regions 240-1, and theetching process then uses patterned mask layer 330 as an etch mask. Insuch embodiments, after the etching process, the patterned mask layer330 can be removed, for example, by a resist stripping process or othersuitable process.

Turning to FIGS. 20A-20D, an n-type work function layer 340 is formedover multigate device 200, particularly over high-k dielectric layer 282in n-type gate regions 240-1 of gate structures 240 and over p-type workfunction layer 320 in p-type gate regions 240-2 of gate structures 240.For example, an ALD process conformally deposits n-type work functionlayer 340 on high-k dielectric layer 282 and p-type work function layer320, such that n-type work function layer 340 has a substantiallyuniform thickness and partially fills gate trenches 275 along the gatelength direction in n-type gate regions 240-1. In n-type gate regions240-1, n-type work function layer 340 is disposed on high-k dielectriclayer 282 and surrounds high-k dielectric layer 282, interfacial layer280, and channel layers 215′. For example, n-type work function layer340 is disposed along sidewalls, tops, and bottoms of channel layers215′. In contrast, in p-type gate regions 240-2, because the disclosedgate replacement process ensures that gate trenches 275 are filled(e.g., the gate dielectric (i.e., high-k dielectric layer 282 andinterfacial layer 280) and the p-type work function layer (i.e., p-typework function layer 300 and p-type work function layer 320)) along thegate length direction in p-type gate regions 240-2, n-type work functionlayer 340 is formed over gate structures 240 in p-type gate regions240-2, in particular, over gate spacers 247. This prevents n-type workfunction layer 340 or any remnants (residue) thereof from affecting thethreshold voltage of the p-type GAA transistors, particularly forshort-channel p-type GAA transistors. In the depicted embodiment, athickness of n-type work function layer 340 completely fills remainingportions of gaps 277B between channel layers 215′ and between channellayers 215′ and substrate 202 in n-type gate regions 240-1. In someembodiments, n-type work function layer 340 has a thickness of about 1nm to about 5 nm. In some embodiments, a thickness of n-type workfunction layer 340 is less than a thickness of the p-type work functionlayer (i.e., a combined thickness of p-type work function layer 300 andp-type work function layer 320). N-type work function layer 340 includesany suitable n-type work function material, such as Ti, Al, Ag, Mn, Zr,TiAl, TiAlC, TiAlSiC, TaC, TaCN, TaSiN, TaAl, TaAlC, TaSiAlC, TiAlN,other n-type work function material, or combinations thereof. In thedepicted embodiment, n-type work function layer 340 includes aluminum.For example, n-type work function layer 340 includes titanium andaluminum, such as TiAl, TiAlC, TaSiAl, or TiSiAlC. Alternatively, n-typework function layer 340 is formed using another suitable depositionprocess, such as CVD, PVD, HDPCVD, MOCVD, RPCVD, PECVD, LPCVD, ALCVD,APCVD, spin coating, plating, other deposition process, or combinationsthereof.

Turning to FIGS. 21A-21D, n-type work function layer 340 is removed fromp-type gate regions 240-2 of gate structures 240, for example, byimplementing a lithography process and an etching process. For example,a patterned mask layer 345 having one or more openings 347 is formedover multigate device 200 by the lithography process, such as thelithography process described above to form patterned mask layer 290.Patterned mask layer 345 covers n-type gate regions 240-1 of gatestructures 240. Patterned mask layer 345 includes a material that isdifferent than a material of n-type work function layer 340 to achieveetching selectivity during removal of n-type work function layer 340.For example, patterned mask layer 345 includes a resist material. Insome embodiments, patterned mask layer 345 has a multi-layer structure,such as a resist layer disposed over an ARC layer. The presentdisclosure contemplates other materials for patterned mask layer 345, solong as etching selectivity is achieved during removal of n-type workfunction layer 340 from n-type gate regions 240-1. Any suitable process,such as the etching processes described herein, is then used tocompletely remove n-type work function layer 340 from p-type gateregions 240-2, thereby exposing p-type work function layer 320 in p-typegate regions 240-2. After the etching process, the patterned mask layer345 can be removed from multigate device 200, for example, by a resiststripping process or other suitable process.

Turning to FIGS. 22A-22D, a metal fill (or bulk) layer 350 is formedover multigate device 200, particularly over n-type work function layer340 in n-type gate regions 240-1 and over p-type work function layer 320in p-type gate regions 240-2. For example, a CVD process or a PVDprocess deposits metal fill layer 350 on n-type work function layer 340and p-type work function layer 320, such that metal fill layer 350 fillsany remaining portion of gate trenches 275, including any remainingportions of gaps 277A in n-type gate regions 240-1. Metal fill layer 350includes a suitable conductive material, such as Al, W, and/or Cu. Metalfill layer 350 may additionally or collectively include other metals,metal oxides, metal nitrides, other suitable materials, or combinationsthereof. In some implementations, a blocking layer is optionally formedover n-type work function layer 340 and p-type work function layer 320before forming metal fill layer 350, such that metal fill layer 350 isdisposed on the blocking layer. For example, an ALD process conformallydeposits the blocking layer on n-type work function layer 340 and p-typework function layer 320, such that the blocking layer has asubstantially uniform thickness and partially fills gate trenches 275.The blocking layer includes a material that blocks and/or reducesdiffusion between gate layers, such as metal fill layer 350 and n-typework function layer 340 and/or p-type work function layers 300, 320.Alternatively, metal fill layer 350 and/or the blocking layer are formedusing another suitable deposition process, such as ALD, CVD, PVD,HDPCVD, MOCVD, RPCVD, PECVD, LPCVD, ALCVD, APCVD, spin coating, plating,other deposition process, or combinations thereof.

Turning to FIGS. 23A-23D, a planarization process is performed to removeexcess gate materials from multigate device 200. For example, a CMPprocess is performed until a top surface of ILD layer 270 is reached(exposed), such that a top surface of gate structures 240 aresubstantially planar with a top surface of ILD layer 270 after the CMPprocess. In the depicted embodiment, gate structures 240 are thusconfigured with two different metal gate portions—n-metal gates 360A inn-type gate regions 240-1 and p-metal gates 360B in p-type gate regions240-2. Metal gates 360A include a gate dielectric (e.g., interfaciallayer 280 and high-k dielectric layer 282) and a gate electrode (e.g.,n-type work function layer 340 and metal fill layer 350). Metal gates360B include a gate dielectric (e.g., interfacial layer 280 and high-kdielectric layer 282) and a gate electrode (e.g., a p-type work functionlayer 362 (e.g., p-type work function layer 300 and p-type work functionlayer 320) and metal fill layer 350). Accordingly, multigate device 200includes n-type GAA transistors having metal gates 360A wrappingrespective channel layers 215′, such that metal gates 360A are disposedbetween respective epitaxial source/drain features 260A, and p-type GAAtransistors having metal gates 360B wrapping respective channel layers215′, such that metal gates 360B are disposed between respectiveepitaxial source/drain features 260B.

Fabrication can proceed to continue fabrication of multigate device 200.For example, various contacts can be formed to facilitate operation ofthe n-type GAA transistors and the p-type GAA transistors. For example,one or more ILD layers, similar to ILD layer 270, and/or CESL layers canbe formed over substrate 202 (in particular, over ILD layer 270 and gatestructures 240). Contacts can then be formed in ILD layer 270 and/or ILDlayers disposed over ILD layer 270. For example, contacts arerespectively electrically and/or physically coupled with gate structures240 and contacts are respectively electrically and/or physically coupledto source/drain regions of the n-type GAA transistors and the p-type GAAtransistors (particularly, epitaxial source/drain features 260A, 260B).Contacts include a conductive material, such as metal. Metals includealuminum, aluminum alloy (such as aluminum/silicon/copper alloy),copper, copper alloy, titanium, titanium nitride, tantalum, tantalumnitride, tungsten, polysilicon, metal silicide, other suitable metals,or combinations thereof. The metal silicide may include nickel silicide,cobalt silicide, tungsten silicide, tantalum silicide, titaniumsilicide, platinum silicide, erbium silicide, palladium silicide, orcombinations thereof. In some implementations, ILD layers disposed overILD layer 270 and the contacts (for example, extending through ILD layer270 and/or the other ILD layers) are a portion of the MLI featuredescribed above.

The present disclosure provides for many different embodiments. Anexemplary method includes forming a gate dielectric layer in a gatetrench in a gate structure. The gate dielectric layer is formed aroundfirst channel layers in a p-type gate region and around second channellayers in an n-type gate region. The method further includes forming ap-type work function layer in the gate trench over the gate dielectriclayer in the p-type gate region and the n-type gate region. In someembodiments, the p-type work function layer completely fills the gatetrench along a gate length direction. Sacrificial features are formedbetween the second channel layers in the n-type gate region beforeforming the p-type work function layer and the sacrificial features areremoved between the second channel layers in the n-type gate regionafter removing the p-type work function layer from the gate trench inthe n-type gate region. In some embodiments, removing the sacrificialfeatures between the second channel layers in the n-type gate regionincludes performing an etching process that selectively etches thesacrificial features without substantially etching the p-type workfunction layer. In some embodiments, p-type work function layer isremoved from the gate trench in the n-type gate region by performing anetching process that selectively etches the p-type work function layerwithout substantially etching the gate dielectric layer and thesacrificial features. The method further includes forming an n-type workfunction layer in the gate trench over the gate dielectric layer in then-type gate region. The n-type work function layer surrounds the gatedielectric layer and the second channel layers in the n-type gateregion. The method further includes forming a metal fill layer in thegate trench over the p-type work function layer in the p-type gateregion and the n-type work function layer in the n-type gate region. Insome embodiments, the n-type work function layer is also formed in thegate trench over the p-type work function layer in the p-type gateregion. In such embodiments, the n-type work function layer is disposedabove gate spacers of the gate structure and the gate trench is free ofthe n-type work function layer along a gate length of the gate trench inthe p-type gate region. In such embodiments, the n-type work functionlayer is removed from the gate trench in the p-type gate region beforeforming the metal fill layer.

In some embodiments, forming the sacrificial features in the gate trenchbetween the second channel layers in the n-type gate region includeforming a sacrificial layer over the gate dielectric layer in the gatetrench. The sacrificial layer and the gate dielectric layer fill gapsbetween the first channel layers in the p-type gate region and the gatedielectric layer and the sacrificial layer fill gaps between the secondchannel layers in the n-type gate region. The sacrificial layer is thenpatterned to form sacrificial features between the first channel layersin the p-type gate region and between the second channel layers in then-type gate region. The sacrificial features are removed from betweenthe first channel layers in the p-type gate region. In some embodiments,removing the sacrificial features from between the first channel layersin the p-type gate region includes performing a lithography process toform a patterned mask layer that covers the n-type gate region andexposes the p-type gate region, and performing an etching process toremove the sacrificial features in the p-type gate region. The etchingprocess can use the patterned mask layer as an etch mask.

In some embodiments, forming the p-type work function layer includesforming a first p-type work function layer in the gate trench over thegate dielectric layer in the p-type gate region and the n-type gateregion, and forming a second p-type work function layer in the gatetrench over the first p-type work function layer in the p-type gateregion and over the gate dielectric layer in the n-type gate region. Insuch embodiments, removing the p-type work function layer from the gatetrench in the n-type gate region includes removing the first p-type workfunction layer from the gate trench in the n-type gate region beforeforming the second p-type work function layer and removing the secondp-type work function layer from the gate trench in the n-type gateregion. In some embodiments, the first p-type work function layer isremoved from the gate trench in the n-type gate region by performing afirst lithography process and a first etching process, where the firstlithography process forms a mask layer that covers the p-type gateregion. In some embodiments, the second p-type work function layer isremoved from the gate trench in the n-type gate region by performing asecond lithography process and a second etching process, where thesecond lithography process forms a mask layer that covers the p-typegate region and a portion of the n-type gate region at a boundary of thep-type gate region and the n-type gate region.

Another exemplary method includes depositing a gate dielectric layerover first semiconductor layers in a p-type gate region and over secondsemiconductor layers in an n-type gate region, wherein the gatedielectric layer wraps the first semiconductor layers and the secondsemiconductor layers. The first semiconductor layers have first gapstherebetween and the second semiconductor layers have second gapstherebetween after depositing the gate dielectric layer. The methodfurther includes depositing a sacrificial layer over the gate dielectriclayer in the p-type gate region and the n-type gate region and etchingthe sacrificial layer in the p-type gate region and the n-type gateregion to form first sacrificial features in the p-type gate regionbetween the first semiconductor layers and second sacrificial featuresin the n-type gate region between the second semiconductor layers. Themethod further includes, after removing the first sacrificial featuresfrom the p-type gate region, depositing a p-type work function layerover the gate dielectric layer in the p-type gate region and the n-typegate region. In some embodiments, a material of the sacrificial layer isdifferent than a material of the p-type work function layer. In someembodiments, a thickness (T) of the p-type work function layer isgreater than or equal to half a gate length (Lg) (T≥0.5 Lg). The methodfurther includes removing the p-type work function layer from over thegate dielectric layer in the n-type gate region, and after removing thesecond sacrificial features from the n-type gate region, depositing ann-type work function layer over the gate dielectric layer in the n-typegate region.

In some embodiments, etching the sacrificial layer, removing the firstsacrificial features from the p-type gate region, and removing thesecond sacrificial features from the n-type gate region each includeperforming a wet etching process that selectively etches the sacrificiallayer without substantially etching the gate dielectric layer. The wetetching process may utilize an ammonium hydroxide based etchingsolution. An etching time of the wet etching process for etching thesacrificial layer is less than an etching time of the wet etchingprocess for removing the first sacrificial features from the p-type gateregion and removing the second sacrificial features from the n-type gateregion. In some embodiments, the etching the p-type work function layerincludes performing a wet etching process that selectively etches thep-type work function layer without substantially etching the gatedielectric layer. The wet etching process can utilize an ammoniumhydroxide/hydrogen chloride/diazine based etching solution.

An exemplary multigate device includes first channel layers disposed ina p-type gate region over a substrate and second channel layers disposedin an n-type gate region over the substrate. A gate stack spans thep-type gate region and the n-type gate region. The gate stack isdisposed between first epitaxial source/drain features disposed in thep-type gate region and second epitaxial source/drain features disposedin the n-type gate region. The gate stack includes a p-metal gate in thep-type gate region that surrounds the first channel layers. The p-metalgate includes a gate dielectric layer, a p-type work function layerdisposed over the gate dielectric layer, and a metal fill layer disposedover the p-type work function layer. The gate stack further includes ann-metal gate in the n-type gate region that surrounds the second channellayers. The n-metal gate includes the gate dielectric layer, an n-typework function layer disposed over the gate dielectric layer, and themetal fill layer disposed over the n-type work function layer. Athickness (T) of the p-type work function layer is greater than or equalto half a gate length (Lg) of the gate stack (T≥0.5 Lg). In someembodiments, the p-type work function layer has a first thickness and asecond thickness in a boundary region between the p-metal gate and then-metal gate, where a difference between the first thickness and thesecond thickness is greater than or equal to about 1 nm. In someembodiments, the thickness of the p-type work function layer is greaterthan a thickness of the n-type work function layer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: forming a gate dielectriclayer in a gate trench in a gate structure, wherein the gate dielectriclayer is formed around first channel layers in a p-type gate region andaround second channel layers in an n-type gate region; formingsacrificial features between the second channel layers in the n-typegate region; forming a p-type work function layer in the gate trenchover the gate dielectric layer in the p-type gate region and the n-typegate region, wherein the p-type work function layer completely fills thegate trench along a gate length direction in the p-type gate region;removing the p-type work function layer from the gate trench in then-type gate region; after removing the p-type work function layer,removing the sacrificial features between the second channel layers inthe n-type gate region; forming an n-type work function layer in thegate trench over the gate dielectric layer in the n-type gate region,wherein the n-type work function layer surrounds the gate dielectriclayer and the second channel layers in the n-type gate region; andforming a metal fill layer in the gate trench over the p-type workfunction layer in the p-type gate region and the n-type work functionlayer in the n-type gate region.
 2. The method of claim 1, wherein theforming the sacrificial features in the gate trench between the secondchannel layers in the n-type gate region includes: forming a sacrificiallayer over the gate dielectric layer in the gate trench, wherein thesacrificial layer and the gate dielectric layer fill gaps between thefirst channel layers in the p-type gate region and the gate dielectriclayer and the sacrificial layer fill gaps between the second channellayers in the n-type gate region; patterning the sacrificial layer toform sacrificial features between the first channel layers in the p-typegate region and between the second channel layers in the n-type gateregion; and removing the sacrificial features from between the firstchannel layers in the p-type gate region.
 3. The method of claim 2,wherein the removing the sacrificial features from between the firstchannel layers in the p-type gate region includes: performing alithography process to form a patterned mask layer that covers then-type gate region and exposes the p-type gate region; and performing anetching process to remove the sacrificial features in the p-type gateregion, wherein the etching process uses the patterned mask layer as anetch mask.
 4. The method of claim 1, wherein the removing thesacrificial features between the second channel layers in the n-typegate region includes performing an etching process that selectivelyetches the sacrificial features without substantially etching the p-typework function layer.
 5. The method of claim 1, wherein: the forming thep-type work function layer in the gate trench over the gate dielectriclayer in the p-type gate region and the n-type gate region includes:forming a first p-type work function layer in the gate trench over thegate dielectric layer in the p-type gate region and the n-type gateregion, and forming a second p-type work function layer in the gatetrench over the first p-type work function layer in the p-type gateregion and over the gate dielectric layer in the n-type gate region; andthe removing the p-type work function layer from the gate trench in then-type gate region includes: removing the first p-type work functionlayer from the gate trench in the n-type gate region before the formingthe second p-type work function layer, and removing the second p-typework function layer from the gate trench in the n-type gate region. 6.The method of claim 5, wherein: the removing the first p-type workfunction layer from the gate trench in the n-type gate region before theforming the second p-type work function layer includes performing afirst lithography process and a first etching process, wherein the firstlithography process forms a mask layer that covers the p-type gateregion; and the removing the second p-type work function layer from thegate trench in the n-type gate region includes performing a secondlithography process and a second etching process, wherein the secondlithography process forms a mask layer that covers the p-type gateregion and a portion of the n-type gate region at a boundary of thep-type gate region and the n-type gate region.
 7. The method of claim 1,wherein the removing the p-type work function layer from the gate trenchin the n-type gate region includes performing an etching process thatselectively etches the p-type work function layer without substantiallyetching the gate dielectric layer and the sacrificial features.
 8. Themethod of claim 1, further comprising: forming the n-type work functionlayer in the gate trench over the p-type work function layer in thep-type gate region, wherein the n-type work function layer is disposedabove gate spacers of the gate structure and the gate trench is free ofthe n-type work function layer along a gate length of the gate trench inthe p-type gate region; and before forming the metal fill layer,removing the n-type work function layer from the gate trench in thep-type gate region.
 9. The method of claim 1, wherein: the forming thegate dielectric layer in the gate trench includes partially fillingfirst spacings between the first channel layers in the p-type gateregion and second spacings between the second channel layers in then-type gate region; and the forming the p-type work function layer inthe gate trench over the gate dielectric layer in the p-type gate regionincludes filling remainders of the first spacings between the firstchannel layers in the p-type gate region.
 10. A method comprising:depositing a gate dielectric layer over first semiconductor layers in ap-type gate region and over second semiconductor layers in an n-typegate region, wherein the gate dielectric layer wraps the firstsemiconductor layers and the second semiconductor layers, wherein thefirst semiconductor layers have first gaps therebetween and the secondsemiconductor layers have second gaps therebetween after depositing thegate dielectric layer; depositing a sacrificial layer over the gatedielectric layer in the p-type gate region and the n-type gate region;etching the sacrificial layer in the p-type gate region and the n-typegate region to form first sacrificial features in the p-type gate regionbetween the first semiconductor layers and second sacrificial featuresin the n-type gate region between the second semiconductor layers; afterremoving the first sacrificial features from the p-type gate region,depositing a p-type work function layer over the gate dielectric layerin the p-type gate region and the n-type gate region; removing thep-type work function layer from over the gate dielectric layer in then-type gate region; and after removing the second sacrificial featuresfrom the n-type gate region, depositing an n-type work function layerover the gate dielectric layer in the n-type gate region.
 11. The methodof claim 10, wherein a material of the sacrificial layer is differentthan a material of the p-type work function layer.
 12. The method ofclaim 10, wherein the etching the sacrificial layer, the removing thefirst sacrificial features from the p-type gate region, and the removingthe second sacrificial features from the n-type gate region includesperforming a wet etching process that selectively etches the sacrificiallayer without substantially etching the gate dielectric layer.
 13. Themethod of claim 12, wherein the wet etching process utilizes an ammoniumhydroxide based etching solution.
 14. The method of claim 12, wherein anetching time of the wet etching process for the etching the sacrificiallayer is less than an etching time of the wet etching process for theremoving the first sacrificial features from the p-type gate region andthe removing the second sacrificial features from the n-type gateregion.
 15. The method of claim 10, wherein the removing the p-type workfunction layer includes performing a wet etching process thatselectively etches the p-type work function layer without substantiallyetching the gate dielectric layer.
 16. The method of claim 15, whereinthe wet etching process utilizes an ammonium hydroxide/hydrogenchloride/diazine based etching solution.
 17. The method of claim 10,wherein a thickness (T) of the p-type work function layer is greaterthan or equal to half a gate length (Lg) (T≥0.5Lg).
 18. A methodcomprising: forming a first gate dielectric that surrounds a firstchannel layer and a second channel layer in a first gate region and asecond gate dielectric that surrounds a third channel layer and a fourthchannel layer in a second gate region, wherein a first gap is between afirst portion of the first gate dielectric that surrounds the firstchannel layer and a second portion of the first gate dielectric thatsurrounds the second channel layer and a second gap is between a firstportion of the second gate dielectric that surrounds the third channellayer and a second portion of the second gate dielectric that surroundsthe fourth channel layer; depositing a dummy layer over the first gatedielectric and the second gate dielectric, wherein the dummy layer fillsthe first gap and the second gap; etching the dummy layer to form afirst dummy feature in the first gap and a second dummy feature in thesecond gap; after removing the first dummy feature from the first gap,forming a first type work function layer over the first gate dielectricand the second gate dielectric, wherein the first type work functionlayer fills the first gap; removing the first type work function layerfrom over the second gate dielectric, wherein a material of the dummylayer is different than a material of the first gate dielectric, amaterial of the second gate dielectric, and a material of the first typework function layer; after removing the second dummy feature from thesecond gap, forming a second type work function layer over the secondgate dielectric in the second gate region, wherein the second type workfunction layer fills the second gap; and forming a metal bulk layer overthe first type work function layer and the second type work functionlayer.
 19. The method of claim 18, wherein: the depositing the dummylayer includes depositing a metal oxide layer; and the etching the dummylayer includes performing a wet etching process.
 20. The method of claim18, wherein the removing the first dummy feature from the first gap andthe removing the second dummy feature from the second gap each includeperforming a wet etching process.